MC860DECZQ50D4R2 Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MC860 for variants of the embedded microprocessor.
MC860DECZQ50D4R2 Features

MC860DECZQ50D4R2 Applications
There are a lot of NXP USA Inc.
MC860DECZQ50D4R2 Microprocessor applications.

Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio

Factory Lead Time	26 Weeks
Package / Case	357-BBGA
Operating Temperature	-40°C~95°C TA
Packaging	Tape & Reel (TR)
Series	MPC8xx
Published	2004
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MC860
Speed	50MHz
Voltage - I/O	3.3V
Ethernet	10Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP	Communications; CPM
RoHS Status	Non-RoHS Compliant