MCIMX6D4AVT10ADR Overview
With a packing size of 624-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 2 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~125°C TJ. A i.MX6D series item. A ARM® Cortex®-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address.
MCIMX6D4AVT10ADR Features
ARM® Cortex®-A9 Core

MCIMX6D4AVT10ADR Applications
There are a lot of NXP USA Inc.
MCIMX6D4AVT10ADR Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Factory Lead Time	15 Weeks
Package / Case	624-FBGA, FCBGA
Operating Temperature	-40°C~125°C TJ
Packaging	Tape & Reel (TR)
Series	i.MX6D
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.0GHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (4)
Additional Interfaces	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant