MC860ENCZQ50D4R2 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MC860 if you are looking for variants.
MC860ENCZQ50D4R2 Features

MC860ENCZQ50D4R2 Applications
There are a lot of NXP USA Inc.
MC860ENCZQ50D4R2 Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	8 Weeks
Package / Case	357-BBGA
Operating Temperature	-40°C~95°C TA
Packaging	Tape & Reel (TR)
Series	MPC8xx
Published	1995
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MC860
Speed	50MHz
Voltage - I/O	3.3V
Ethernet	10Mbps (4)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP	Communications; CPM
RoHS Status	Non-RoHS Compliant