MCIMX233CJM4C Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 169-LFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~85°C TA. The cpu microprocessor belongs to the i.MX23 series. The CPU is cored with a ARM926EJ-S processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART. In this CPU, I/O is set to 2.0V 2.5V 2.7V 3.0V 3.3V. The microprocessor can be searched for with MCIMX233 if you are looking for variants.
MCIMX233CJM4C Features
ARM926EJ-S Core

MCIMX233CJM4C Applications
There are a lot of NXP USA Inc.
MCIMX233CJM4C Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	15 Weeks
Package / Case	169-LFBGA
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	i.MX23
Published	2004
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MCIMX233
Speed	454MHz
Core Processor	ARM926EJ-S
Voltage - I/O	2.0V 2.5V 2.7V 3.0V 3.3V
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
USB	USB 2.0 + PHY (1)
Additional Interfaces	I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Co-Processors/DSP	Data; DCP
Security Features	Cryptography, Hardware ID
Display & Interface Controllers	LCD, Touchscreen
RoHS Status	ROHS3 Compliant