MCIMX6DP5EYM1AB Overview
The embedded microprocessor has been packed in 624-LFBGA, FCBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 2 Core 32-Bit cores and width 2 Core 32-Bit busses is used. Understand how the operating temperature around -20°C~105°C TJ is determined. This is a member of the i.MX6DP series. With a core count of ARM® Cortex®-A9, this CPU is multicore. A CPU with this architecture uses LPDDR2, DDR3L, DDR3 RAM controllers. With its CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces, this microprocessor will be able to serve you better. The CPU runs at 1.8V 2.5V 2.8V 3.3V when it comes to I/O.
MCIMX6DP5EYM1AB Features
ARM® Cortex®-A9 Core

MCIMX6DP5EYM1AB Applications
There are a lot of NXP USA Inc.
MCIMX6DP5EYM1AB Microprocessor applications.

Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products

Factory Lead Time	15 Weeks
Package / Case	624-LFBGA, FCBGA
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX6DP
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.39.00.01
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	1.0GHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, DDR3L, DDR3
USB	USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces	CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers	HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant