MCIMX6L2EVN10AC OverviewThe embedded microprocessor has been packed in 432-TFBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~105°C TA is determined. This is a member of the i.MX6SL series. With a core count of ARM® Cortex®-A9, this CPU is multicore. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. With its AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces, this microprocessor will be able to serve you better. The CPU runs at 1.2V 1.8V 3.0V when it comes to I/O. uPs/uCs/Peripheral ICs type is MICROPROCESSOR, RISC. There is a maximum supply current of 1.5V in this microprocessor.
MCIMX6L2EVN10AC FeaturesARM® Cortex®-A9 Core
MCIMX6L2EVN10AC ApplicationsThere are a lot of NXP USA Inc.
MCIMX6L2EVN10AC Microprocessor applications.
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products
| Factory Lead Time | 15 Weeks |
| Package / Case | 432-TFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Series | i.MX6SL |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.375V |
| Speed | 1.0GHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.2V 1.8V 3.0V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| Additional Interfaces | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| Length | 13mm |
| Height Seated (Max) | 1.1mm |
| RoHS Status | ROHS3 Compliant |