MCIMX6X1CVO08AC,NXP USA Inc. MCIMX6X1CVO08AC supplier,NXP USA Inc. MCIMX6X1CVO08AC priceIntegrated Circuits (ICs)
MCIMX6X1CVO08AC,NXP USA Inc. MCIMX6X1CVO08AC supplier,NXP USA Inc. MCIMX6X1CVO08AC priceIntegrated Circuits (ICs)
MCIMX6X1CVO08AC
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MCIMX6X1CVO08AC
    Part Number:KY-MCIMX6X1CVO08AC
    Mfr. Part No:MCIMX6X1CVO08AC
    Mfr.:NXP USA Inc.
    Stock:13253
    Description: 0.8mm ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor i.MX6SX Series 400-LFBGA
    Data Sheet:MCIMX6X1CVO08AC Datasheet
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  • MCIMX6X1CVO08AC Overview
    Since the microprocessor is packed in 400-LFBGA, shipping overseas is convenient. High reliability is achieved by using advanced packaging methods Tray. This CPU has 2 Core 32-Bit cores and 2 Core 32-Bit bus widths. K-40°C~105°C TAw what the operating temperature is around -40°C~105°C TA. In the series i.MX6SX, it is found. ARM® Cortex®-A9, ARM® Cortex®-M4 processors are embedded in this CPU. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. Microprocessors with AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces are designed to serve users better. 1.8V 2.5V 2.8V 3.15V is the I/O speed of this CPU. The total number of terminations is 400. 1.5V is its maximum supply current. There is a wide width of 32 on the external data bus of this CPU. In CPU programs, data is transferred by 14 I/Os.
    MCIMX6X1CVO08AC Features
    ARM® Cortex®-A9, ARM® Cortex®-M4 Core
    14 I/Os

    MCIMX6X1CVO08AC Applications
    There are a lot of NXP USA Inc.
    MCIMX6X1CVO08AC Microprocessor applications.

    Instrument control
    Consumer electronics products
    Toys
    Robots
    Radio
    Television
    Heater/Fan
    Calculator
    Kindle
    Christmas lights
    Factory Lead Time15 Weeks
    Package / Case400-LFBGA
    Surface MountYES
    Operating Temperature-40°C~105°C TA
    PackagingTray
    Seriesi.MX6SX
    Published2017
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations400
    HTS Code8542.39.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)260
    Terminal Pitch0.8mm
    Time@Peak Reflow Temperature-Max (s)40
    JESD-30 CodeS-PBGA-B400
    Supply Voltage-Max (Vsup)1.5V
    Supply Voltage-Min (Vsup)1.275V
    Number of I/O14
    Speed200MHz, 800MHz
    Core ProcessorARM® Cortex®-A9, ARM® Cortex®-M4
    Address Bus Width15
    Boundary ScanYES
    External Data Bus Width32
    RAM (words)144K
    Voltage - I/O1.8V 2.5V 2.8V 3.15V
    Ethernet10/100/1000Mbps (2)
    Number of Cores/Bus Width2 Core 32-Bit
    Graphics AccelerationNo
    RAM ControllersLPDDR2, LVDDR3, DDR3
    USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
    Additional InterfacesAC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
    Co-Processors/DSPMultimedia; NEON™ MPE
    Bus CompatibilityCAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB
    Security FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
    Display & Interface ControllersKeypad, LCD
    Length17mm
    Height Seated (Max)1.53mm
    RoHS StatusROHS3 Compliant
    
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