MCIMX6Y7DVK05AB Overview
With a packing size of 272-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~95°C TJ. A i.MX6 series item. A ARM® Cortex®-A7 processor is present in this CPU. The CPU contains LPDDR2, DDR3, DDR3L RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, SPI, UART. 1.8V 2.8V 3.3V is the CPU's I/O address.
MCIMX6Y7DVK05AB Features
ARM® Cortex®-A7 Core

MCIMX6Y7DVK05AB Applications
There are a lot of NXP USA Inc.
MCIMX6Y7DVK05AB Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Factory Lead Time	18 Weeks
Package / Case	272-LFBGA
Operating Temperature	0°C~95°C TJ
Packaging	Tray
Series	i.MX6
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.39.00.01
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	528MHz
Core Processor	ARM® Cortex®-A7
Voltage - I/O	1.8V 2.8V 3.3V
Ethernet	10/100Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	LPDDR2, DDR3, DDR3L
USB	USB 2.0 OTG + PHY (2)
Additional Interfaces	CAN, I2C, SPI, UART
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers	Electrophoretic, LCD
RoHS Status	ROHS3 Compliant