MCIMX7S3EVK08SD Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 488-TFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -20°C~105°C TJ. The cpu microprocessor belongs to the i.MX7S series. The CPU is cored with a ARM® Cortex®-A7, ARM® Cortex®-M4 processor. The CPU uses LPDDR2, LPDDR3, DDR3, DDR3L RAM controllers. This microprocessor features interfaces AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART. In this CPU, I/O is set to 1.8V 3.3V. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR, RISC.
MCIMX7S3EVK08SD Features
ARM® Cortex®-A7, ARM® Cortex®-M4 Core

MCIMX7S3EVK08SD Applications
There are a lot of NXP USA Inc.
MCIMX7S3EVK08SD Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	16 Weeks
Package / Case	488-TFBGA
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX7S
Published	2012
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	800MHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O	1.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	LPDDR2, LPDDR3, DDR3, DDR3L
USB	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Additional Interfaces	AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers	Keypad, LCD, MIPI
RoHS Status	ROHS3 Compliant