MPC8560VT667LB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 784-BBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC85xx series. The CPU is cored with a PowerPC e500 processor. The CPU uses DDR, SDRAM RAM controllers. This microprocessor features interfaces I2C, PCI, RapidIO, SPI, TDM, UART. In this CPU, I/O is set to 2.5V 3.3V. The microprocessor can be searched for with MPC8560 if you are looking for variants.
MPC8560VT667LB Features
PowerPC e500 Core

MPC8560VT667LB Applications
There are a lot of NXP USA Inc.
MPC8560VT667LB Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Package / Case	784-BBGA, FCBGA
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2002
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8560
Speed	667MHz
Core Processor	PowerPC e500
Voltage - I/O	2.5V 3.3V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR, SDRAM
Additional Interfaces	I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; CPM
RoHS Status	ROHS3 Compliant