LS1026AXE8P1A Overview
Packed in 780-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 64-Bit cores/Bus width. Extended operating temperature around -40°C~105°C. It comes from the QorIQ® Layerscape series. This CPU is cored with a ARM® Cortex®-A72 processor. This CPU uses DDR4 RAM controllers. There are 780 terminations totally. With a 1V voltage supply, the part should be turned on and run. The supply voltage should not exceed 1.03V. This CPU has a wide external data Bus width of 64. The CPU programs, transfers data by 76 I/Os.
LS1026AXE8P1A Features
ARM® Cortex®-A72 Core
76 I/Os

LS1026AXE8P1A Applications
There are a lot of NXP USA Inc.
LS1026AXE8P1A Microprocessor applications.

Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Surface Mount	YES
Operating Temperature	-40°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2016
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	780
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	250
Supply Voltage	1V
Terminal Pitch	0.8mm
Time@Peak Reflow Temperature-Max (s)	30
JESD-30 Code	S-PBGA-B780
Supply Voltage-Max (Vsup)	1.03V
Supply Voltage-Min (Vsup)	0.97V
Number of I/O	76
Speed	1.4GHz
Core Processor	ARM® Cortex®-A72
Address Bus Width	14
Boundary Scan	YES
External Data Bus Width	64
Ethernet	10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR4
USB	USB 3.0 (3) + PHY
Bus Compatibility	I2C, PCI, SPI, UART, USB
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
Length	23mm
Height Seated (Max)	2.61mm
RoHS Status	ROHS3 Compliant