MPC8569CVTANKGB Overview
Due to its 783-BBGA, FCBGA packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the MPC85xx series. PowerPC e500v2 is the processor core of this CPU. Memory controllers for this CPU are DDR2, DDR3, SDRAM. Featuring DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART interfaces, this microprocessor can better serve you. There is 1.0V 1.5V 1.8V 2.5V 3.3V I/O running on this CPU. MPC8569 is a good way to search for variants of the microprocessor. Suppliers offer the package 783-FCPBGA (29x29).
MPC8569CVTANKGB Features
PowerPC e500v2 Core

MPC8569CVTANKGB Applications
There are a lot of NXP USA Inc.
MPC8569CVTANKGB Microprocessor applications.

Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens

Package / Case	783-BBGA, FCBGA
Supplier Device Package	783-FCPBGA (29x29)
Operating Temperature	-40°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2010
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8569
Speed	800MHz
Core Processor	PowerPC e500v2
Voltage - I/O	1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet	10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR2, DDR3, SDRAM
USB	USB 2.0 (1)
Additional Interfaces	DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; QUICC Engine
RoHS Status	ROHS3 Compliant