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The OSD32MP157C-512M-BAA System-in-Package (SiP) device delivers all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP157C-512M-BAA has the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4. Along with the processor, the OSD32MP157C-512M-BAA integrates up to 1GB of DDR3L, STPMIC1 Power Management IC, EEPROM, MEMsOscillator, and passives into a single easy-to-use BGA package.
ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillatorandpassive components integrated into a single package
Arm®Cortex®-A7up to 800MHzx2
Arm® Cortex®-M4 up to 209MHz
NEON™SIMD Coprocessor x2
Arm® TrustZone®
USB 2.0 HS + PHY x2
Ethernet 10/100/1000
CANFD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6,I2S x3, QSPI x2
eMMC/SD/SDIO Ports x3
GPIO x148
24-bit RGB Display, MIPI DSI
Camera Interface
22 Channel 16-bit ADC x2, 12-bit DAC x2
Microwave ovens
Traffic lights
| Factory Lead Time | 8 Weeks |
| Operating Temperature | 0°C~85°C |
| Series | OSD32MP15x |
| Size / Dimension | 0.709 x 0.709 18mmx18mm |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Connector Type | 302-BGA |
| Speed | 650MHz, 209MHz |
| Core Processor | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 |
| Module/Board Type | MPU Core |
| Co-Processor | NEON™ SIMD |
| RoHS Status | ROHS3 Compliant |
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