TE0808-04-09EG-2IE,Trenz Electronic GmbH TE0808-04-09EG-2IE supplier,Trenz Electronic GmbH TE0808-04-09EG-2IE priceIntegrated Circuits (ICs)
TE0808-04-09EG-2IE,Trenz Electronic GmbH TE0808-04-09EG-2IE supplier,Trenz Electronic GmbH TE0808-04-09EG-2IE priceIntegrated Circuits (ICs)
TE0808-04-09EG-2IE
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TE0808-04-09EG-2IE
    Part Number:KY-TE0808-04-09EG-2IE
    Mfr. Part No:TE0808-04-09EG-2IE
    Mfr.:Trenz Electronic GmbH
    Stock:3638
    Description: MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05 x 2.99 52mmx76mm -40°C~85°C 128MB B2B TE0808 4GB
    Data Sheet:TE0808-04-09EG-2IE Datasheet
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In Stock: 3638
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  • TE0808-04-09EG-2IE Overview
    Microcontroller MPU Core is a module or board.A Zynq UltraScale+ XCZU9EG-1FFVC900E-core processor drives microprocessor chip.Default settings for the microcontroller are -40°C~85°C.128MB is the size of the flash on the MCU electronics.The connector type is B2B.TE0808-Series.The RAM is reduced to 4GB in order to ensure that the software is able to run normally.
    TE0808-04-09EG-2IE Features
    Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
    Flash size of 128MB

    TE0808-04-09EG-2IE Applications
    There are a lot of Trenz Electronic GmbH
    TE0808-04-09EG-2IE Microcontroller, Microprocessor, FPGA Modules applications.

    Industrial Instrumentation
    Embedded Control Processing
    Embedded User Interfaces
    Test and Measurement
    Medical Devices
    Data Acquisition
    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Factory Lead Time14 Weeks
    Operating Temperature-40°C~85°C
    SeriesTE0808
    Size / Dimension2.05 x 2.99 52mmx76mm
    Part StatusObsolete
    Moisture Sensitivity Level (MSL)1 (Unlimited)
    Connector TypeB2B
    RAM Size4GB
    Core ProcessorZynq UltraScale+ XCZU9EG-1FFVC900E
    Module/Board TypeMPU Core
    Flash Size128MB
    
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