This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 625-BFBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU2EG-1SFVA625I System On Chip (SoC) applications.

Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances

Factory Lead Time	11 Weeks
Package / Case	625-BFBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Zynq® UltraScale+™ MPSoC EG
Published	2013
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	180
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status	ROHS3 Compliant