MPC8560PX833LB Overview
With a packing size of 784-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~105°C TA. A MPC85xx series item. A PowerPC e500 processor is present in this CPU. The CPU contains DDR, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, PCI, RapidIO, SPI, TDM, UART. 2.5V 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with MPC8560.
MPC8560PX833LB Features
PowerPC e500 Core

MPC8560PX833LB Applications
There are a lot of NXP USA Inc.
MPC8560PX833LB Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Package / Case	784-BBGA, FCBGA
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2002
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8560
Speed	833MHz
Core Processor	PowerPC e500
Voltage - I/O	2.5V 3.3V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR, SDRAM
Additional Interfaces	I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; CPM
RoHS Status	Non-RoHS Compliant